au.\*:("YONEZAWA, Toshihiro")
Results 1 to 1 of 1
Selection :
Copper electrodeposition of high-aspect-ratio vias for three dimensional packagingKONDO, Kazuo; YONEZAWA, Toshihiro; TOMISAKA, Manabu et al.Proceedings - Electrochemical Society. 2003, pp 28-32, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper
